Intel and AWS Co-Invest in Custom Chip Designs for AI Growth

Key Highlights:

  • Intel and AWS co-invest in multi-billion-dollar custom chip designs under a long-term collaboration.

  • Intel to produce AI fabric chip on Intel 18A and custom Xeon 6 chip on Intel 3 for AWS.

  • Collaboration supports AI growth and U.S.-based semiconductor manufacturing in Ohio.

  • AWS to invest $7.8 billion in Ohio data center expansion.

Notable Quotes:

“Intel’s chip design and manufacturing capabilities, combined with the comprehensive and broadly adopted cloud, AI and machine learning services of AWS, will unleash innovation across our shared ecosystem and support the growth of both businesses, as well as a sustainable domestic AI supply chain.”

Pat Gelsinger, CEO at Intel

“By co-developing next-generation AI fabric chips on Intel 18A, we continue our long-standing collaboration... empowering our joint customers with the ability to run any workload and unlock new AI capabilities.”

Matt Garman, CEO at AWS

“Today’s announcement furthers Intel’s commitment to U.S. manufacturing sites, like Ohio’s, as well as AWS’s commitment to its nearly decade-long investment in our state.”

Mike DeWine, Governor at Ohio

Our Take:

This collaboration between Intel and AWS marks a significant leap in U.S.-based semiconductor manufacturing, emphasizing their focus on bolstering AI capabilities. With Intel’s advanced process nodes and AWS’s expansive cloud infrastructure, this partnership sets the stage for innovation across various industries, especially AI. Furthermore, the investment in Ohio solidifies the region as a critical hub for future AI and semiconductor advancements. This collaboration is poised to not only accelerate business outcomes but also strengthen the domestic technology ecosystem.